Title:
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/009976
Kind Code:
A1
Abstract:
The present invention makes it easier to perform printing on a module surface. This high frequency module (100) comprises a mounting substrate (9), an elastic wave filter (1), a protective member (4), a resin layer (5), and a shield layer (6). The elastic wave filter (1) is mounted on a first main surface (91) of the mounting substrate (9). The protective member (4) is disposed on a main surface of the elastic wave filter (1) on a side opposite to the mounting substrate (9) side. The resin layer (5) is disposed on the first main surface (91) of the mounting substrate (9) and covers the outer peripheral surface (803) of the elastic wave filter (1) and the outer peripheral surface (43) of the protective member (4). The shield layer (6) covers the resin layer (5) and the protective member (4). The protective member (4) is in contact with both the elastic wave filter (1) and the shield layer (6). The elastic wave filter (1) has a piezoelectric substrate (10). A main surface of the piezoelectric substrate (10) on a side opposite to the mounting substrate (9) side is in contact with the protective member (4).
Inventors:
MATSUMOTO NAOYA
UEJIMA TAKANORI
TAKEMATSU YUJI
NAKAGAWA DAI
UEJIMA TAKANORI
TAKEMATSU YUJI
NAKAGAWA DAI
Application Number:
PCT/JP2021/025910
Publication Date:
January 13, 2022
Filing Date:
July 09, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01L23/28; H03H9/02; H03H9/17; H03H9/25; H03H9/54; H03H9/64; H03H9/70; H03H9/72
Domestic Patent References:
| WO2016088681A1 | 2016-06-09 | |||
| WO2020122005A1 | 2020-06-18 | |||
| WO2018198508A1 | 2018-11-01 | |||
| WO2019065027A1 | 2019-04-04 | |||
| WO2007114224A1 | 2007-10-11 | |||
| WO2018235522A1 | 2018-12-27 |
Foreign References:
| JP2006120981A | 2006-05-11 | |||
| JP2006060747A | 2006-03-02 | |||
| JP2013198073A | 2013-09-30 | |||
| JP2017157922A | 2017-09-07 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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