Title:
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/102197
Kind Code:
A1
Abstract:
The present invention lowers the profile of a high frequency module. A high frequency module (100) is provided with a mounting substrate (9), a filter (1), and an electrically conductive member (3). The mounting substrate (9) has a first major surface (91) and a second major surface (92) opposing each other. The filter (1) is mounted on the first major surface (91) of the mounting substrate (9). The electrically conductive member (3) covers at least a part of a major surface (11) of the filter (1) on a side opposite the side of the mounting substrate (9). The first major surface (91) of the mounting substrate (9) has a recess (911). The major surface (11) of the filter (1) is in contact with the electrically conductive member (3). At least a part of the filter (1) is positioned in the recess (911).
Inventors:
UEJIMA TAKANORI
TAKEMATSU YUJI
NAKAGAWA DAI
YAMAGUCHI YUKIYA
TAKEMATSU YUJI
NAKAGAWA DAI
YAMAGUCHI YUKIYA
Application Number:
PCT/JP2021/030583
Publication Date:
May 19, 2022
Filing Date:
August 20, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01L23/28; H01L25/07; H01L25/18; H03H9/25; H03H9/72; H04B1/00; H04B1/38; H05K1/02; H05K1/18
Domestic Patent References:
| WO2007114224A1 | 2007-10-11 |
Foreign References:
| JP2005536879A | 2005-12-02 | |||
| JP2015023474A | 2015-02-02 | |||
| JP2004135193A | 2004-04-30 | |||
| JP2020102693A | 2020-07-02 | |||
| JP2020137026A | 2020-08-31 | |||
| JP2013030850A | 2013-02-07 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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