Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/102284
Kind Code:
A1
Abstract:
This high-frequency module (1) comprises: a module substrate (91); a first component positioned on a main surface (91a) of the module substrate (91); a metal shield wall (81) that is positioned on an upper surface (61a) of the first component and that is set to a ground potential; a resin member (92) that covers the main surface (91a) of the module substrate (91), the upper surface (61a) and side surface of the first component, and the side surface of the metal shield wall (81); and a metal shield layer (95) that covers an upper surface (92a) of the resin member (92) and that is set to a ground potential. An upper end (81a) of the metal shield wall (81) is in contact with the metal shield layer (95). The first component includes a first terminal (61c) and a second terminal (61d) that are connected to the module substrate (91). In a plan view of the main surface (91a), the metal shield wall (81) is positioned between the first terminal (61c) and the second terminal (61d).
Inventors:
UEJIMA TAKANORI (JP)
KITAJIMA HIROMICHI (JP)
KITAJIMA HIROMICHI (JP)
Application Number:
PCT/JP2021/036701
Publication Date:
May 19, 2022
Filing Date:
October 04, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01L23/28; H01L25/04; H01L25/18; H03H9/70; H03H9/72; H04B1/00; H04B1/38; H05K9/00
Domestic Patent References:
| WO2019216299A1 | 2019-11-14 |
Foreign References:
| JP2020126921A | 2020-08-20 | |||
| US20140308907A1 | 2014-10-16 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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