Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/113820
Kind Code:
A1
Abstract:
Provided is a high-frequency module that can be downsized without loss of external connecting members. The high-frequency module (1) comprises a mounting board (30), an electronic component (12), and a resin layer (32B). The electronic component (12) is mounted on a principal surface (36) of the mounting board (30). The resin layer (32B) is provided on the mounting board (30) and covers side surfaces of the electronic component (12). The electronic component 12 has connecting terminals (122), a conductor layer (124), and through-vias (123). The connecting terminals (122) are provided on a principal surface (126) of the electronic component (12) on the side having the mounting board (30), and are connected to the mounting board (30) via connecting members (125). The conductor layer (124) is provided to a principal surface (127) of the electronic component (12) on the side opposite the side having the mounting board (30). The through-vias (123) penetrate from the principal surface (126) to the principal surface (127) of the electronic component (12) and connect the connecting terminals (122) and the conductor layer (124).
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Inventors:
OSHITA TERUAKI
Application Number:
PCT/JP2021/042052
Publication Date:
June 02, 2022
Filing Date:
November 16, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01L23/12; H01L25/00; H01L25/04; H01L25/065; H01L25/07; H01L25/18; H04B1/38
Domestic Patent References:
| WO2020090557A1 | 2020-05-07 | |||
| WO2020071021A1 | 2020-04-09 | |||
| WO2019244815A1 | 2019-12-26 |
Foreign References:
| JP2019192729A | 2019-10-31 | |||
| JP2004128288A | 2004-04-22 | |||
| JP2015018987A | 2015-01-29 | |||
| JP2020102693A | 2020-07-02 | |||
| JP2020120185A | 2020-08-06 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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