Title:
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/123892
Kind Code:
A1
Abstract:
This high frequency module (1A) is provided with: a module substrate (80); an electronic component which is arranged on a main surface (80a); a resin member (81) which covers at least a part of the main surface (80a) and at least a part of the lateral surface of the electronic component; and a metal shield layer (85) which is formed on the surface of the resin member (81), while being set to the ground potential. With respect to this high frequency module (1A), the electronic component has a top surface which is in contact with the metal shield layer (85), a bottom surface which faces the main surface (80a), a circuit part which is formed at a position where the circuit part is closer to the bottom surface than to the top surface, and a metal layer that is formed between the metal shield layer (85) and the circuit part; and the metal layer is a barrier metal.
Inventors:
UEJIMA TAKANORI (JP)
YANASE SHOGO (JP)
AOKI YUUTO (JP)
YAMAGUCHI YUKIYA (JP)
YANASE SHOGO (JP)
AOKI YUUTO (JP)
YAMAGUCHI YUKIYA (JP)
Application Number:
PCT/JP2021/037690
Publication Date:
June 16, 2022
Filing Date:
October 12, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01L25/04; H01L25/18; H03H9/25; H04B1/38
Domestic Patent References:
| WO2015178227A1 | 2015-11-26 |
Foreign References:
| JP2020102693A | 2020-07-02 | |||
| JP2001102517A | 2001-04-13 | |||
| JP2020053812A | 2020-04-02 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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