Title:
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/130733
Kind Code:
A1
Abstract:
The present invention improves isolation between a plurality of electronic components. A high frequency module (100) comprises: a mounting substrate (10); a first electronic component (201) and a second electronic component (202); a metal member (108); a first metal layer (106); a resin layer (105); and a second metal layer (107). The metal member (108) is disposed between the first electronic component (201) and the second electronic component (202) on a first main surface (101) of the mounting substrate (10). The first metal layer (106) is disposed on the first main surface (101) of the mounting substrate (10). The second metal layer (107) covers at least a part of the resin layer (105). The first metal layer (106) has a ground potential and is in contact with the second metal layer (107). The metal member (108) is in contact with the first metal layer (106) and the second metal layer (107).
Inventors:
HANAOKA KUNITOSHI
Application Number:
PCT/JP2021/036128
Publication Date:
June 23, 2022
Filing Date:
September 30, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01L23/28; H01L25/04; H01L25/18; H03H9/25; H03H9/72; H04B1/38; H05K9/00
Domestic Patent References:
| WO2019098316A1 | 2019-05-23 | |||
| WO2007114224A1 | 2007-10-11 |
Foreign References:
| JP2015111748A | 2015-06-18 | |||
| JP2016096439A | 2016-05-26 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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