HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE

WIPO Patent Application WO/2022/131157

A1

The present invention provides a high-frequency module that can be miniaturized in a configuration provided with an inductor and a switch for switching conduction/non-conduction between the inductor and a signal path. A high-frequency module (1) is provided with a mounting board (16), a plurality of external connection terminals, an inductor (7), and an integrated circuit element (17). The mounting board (16) has a first main surface (161) and a second main surface (162) that are mutually opposed. The plurality of external connection terminals is provided in the second main surface (162) of the mounting board (16) and includes an antenna terminal. The inductor (7) is connected between a signal path for a signal passing the antenna terminal and a ground. The integrated circuit element (17) includes a switch (31). The switch (31) is connected between the signal path and the inductor (7) to switch conduction/non-conduction between the signal path and the inductor (7). The inductor (7) is mounted on the first main surface (161) of the mounting board (16), and the integrated circuit element (17) is mounted on the second main surface (162) of the mounting board (16).

HARADA SHUN
KITA TERUMICHI
ITO TAKANORI

PCT/JP2021/045531

June 23, 2022

December 10, 2021

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MURATA MANUFACTURING CO (JP)

H01L23/12; H01L25/00; H03H7/38; H03H9/72; H04B1/00; H04B1/40

WO2018168653A1

2018-09-20

JP2015023557A	2015-02-02
JP2011040602A	2011-02-24
JP2018026795A	2018-02-15

HOKUTO PATENT ATTORNEYS OFFICE (JP)

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