Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/137892
Kind Code:
A1
Abstract:
A high-frequency module (1A) comprises: a module substrate (91) that has main surfaces (91a and 91b) facing one another; a transmission filter (63T) that has a base surface (63a) and a top surface (63b) facing one another, and allows high-frequency signals to pass therethrough; and an external connection terminal (150) that is disposed on the main surface (91b). The base surface (63a) is disposed facing the main surface (91a) and closer to the main surface (91b) than the top surface (63b). The high-frequency module (1A) further comprises a metal electrode (65) that is joined to the top surface (63b).
Inventors:
YAMAGUCHI YUKIYA (JP)
YANASE SHOGO (JP)
AOKI YUUTO (JP)
UEJIMA TAKANORI (JP)
YANASE SHOGO (JP)
AOKI YUUTO (JP)
UEJIMA TAKANORI (JP)
Application Number:
PCT/JP2021/042038
Publication Date:
June 30, 2022
Filing Date:
November 16, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L25/18; H01L25/04; H03H9/17; H03H9/25; H03H9/54; H03H9/64; H04B1/00; H04B1/38
Domestic Patent References:
| WO2017043427A1 | 2017-03-16 | |||
| WO2007114224A1 | 2007-10-11 | |||
| WO2020090230A1 | 2020-05-07 |
Foreign References:
| JP2020102693A | 2020-07-02 | |||
| JP2005217670A | 2005-08-11 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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