Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/209734
Kind Code:
A1
Abstract:
A high-frequency module (1A) comprises: a module substrate (91) having main surfaces (91a and 91b); a module substrate (92) having main surfaces (92a and 92b), the main surface (92a) being disposed so as to face the main surface (91b); and a plurality of electronic components provided between the main surfaces (91b and 92a), on the main surface (91a), and on the main surface (92b). The plurality of electronic components include: a first electronic component including a power amplifier (11); a second electronic component including a low-noise amplifier (21); a switch (52) by which the connection between a first filter and the power amplifier (11) is switched on and off; and a third electronic component including a PA controller for controlling the power amplifier (11) or a switch controller for controlling the switch (52). The first electronic component, the second electronic component, and the third electronic component are separately disposed on the main surface (91a), between the main surfaces (91b and 92a), and on the main surface (92b).
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Inventors:
DAIMON YOSHIHIRO (JP)
YAMADA TAKASHI (JP)
KITAJIMA HIROMICHI (JP)
AIKAWA KIYOSHI (JP)
UEJIMA TAKANORI (JP)
YAMADA TAKASHI (JP)
KITAJIMA HIROMICHI (JP)
AIKAWA KIYOSHI (JP)
UEJIMA TAKANORI (JP)
Application Number:
PCT/JP2022/010812
Publication Date:
October 06, 2022
Filing Date:
March 11, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L25/00; H01F1/26; H03F3/24; H03H9/25; H04B1/00; H04B1/38
Domestic Patent References:
| WO2020022180A1 | 2020-01-30 | |||
| WO2021006020A1 | 2021-01-14 |
Foreign References:
| US20210091796A1 | 2021-03-25 | |||
| JP2016103540A | 2016-06-02 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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