Title:
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/209736
Kind Code:
A1
Abstract:
A high frequency module (1A) is provided with: a module substrate (91) having main surfaces (91a and 91b) opposing each other; a module substrate (92) having main surfaces (92a and 92b) opposing each other with the main surface (92a) disposed facing the main surface (91b); a plurality of electronic components disposed between the main surfaces (91b and 92a), on the main surface (91a), and on the main surface (92b); and a plurality of external connection terminals (150) disposed on the main surface (92b). The plurality of electronic components include a first electronic component (matching circuits (401, 411, 431, 441, and 461)) having a bottom surface and a top surface opposing each other. Of the first electronic component, the bottom surface is bonded to the main surface (92a), and the top surface protrudes beyond the the main surface (91b).
Inventors:
KITAJIMA HIROMICHI (JP)
UEJIMA TAKANORI (JP)
AIKAWA KIYOSHI (JP)
DAIMON YOSHIHIRO (JP)
YAMADA TAKASHI (JP)
UEJIMA TAKANORI (JP)
AIKAWA KIYOSHI (JP)
DAIMON YOSHIHIRO (JP)
YAMADA TAKASHI (JP)
Application Number:
PCT/JP2022/010814
Publication Date:
October 06, 2022
Filing Date:
March 11, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L25/00; H03F3/24; H03H9/25; H04B1/00; H04B1/38
Domestic Patent References:
| WO2020022180A1 | 2020-01-30 | |||
| WO2014178153A1 | 2014-11-06 |
Foreign References:
| JP2020102693A | 2020-07-02 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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