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Title:
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/209738
Kind Code:
A1
Abstract:
A high frequency module (1A) comprises a first electronic component disposed on one of a main surface (91a) and a main surface (92b), and a second electronic component disposed on the other of the main surface (91a) and the main surface (92b). The first electronic component includes at least one of a filter (61) having a passband including a first band, a switch (51) connected to the filter (61), a power amplifier (11) connected to the filter (61), and a switch (52) connected to the filter (61). The second electronic component includes at least one of a filter (66) having a passband including a second band including a harmonic of a signal of the first band, a switch (54) connected to the filter (66), a low-noise amplifier (22) connected to the filter (66), and an inductor connected to a path connecting the low-noise amplifier (22) and an antenna connection terminal (102).

Inventors:
KITAJIMA HIROMICHI (JP)
UEJIMA TAKANORI (JP)
AIKAWA KIYOSHI (JP)
YAMADA TAKASHI (JP)
DAIMON YOSHIHIRO (JP)
Application Number:
PCT/JP2022/010816
Publication Date:
October 06, 2022
Filing Date:
March 11, 2022
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L25/00; H03F3/24; H04B1/00; H04B1/38
Domestic Patent References:
WO2020090557A12020-05-07
WO2020071021A12020-04-09
WO2020022180A12020-01-30
WO2019244816A12019-12-26
Foreign References:
JP2021048567A2021-03-25
JP2005203633A2005-07-28
JP2002359327A2002-12-13
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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