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Title:
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/209749
Kind Code:
A1
Abstract:
A high frequency module (1A) comprises: a module substrate (91) having main surfaces (91a, 91b) facing each other; a module substrate (92) having main surfaces (92a, 92b) facing each other, the main surface (92a) being disposed facing the main surface (91b); a plurality of electronic components disposed between the main surfaces (91b, 92a), on the main surface (91a), and on the main surface (92b); and a first inductor disposed inside the module substrate (91). The plurality of electronic components include a first filter, and a switch (51) which switches between connection and non-connection between an antenna connection terminal (100) and the first filter. The first inductor is connected between the switch (51) and the first filter, and the module substrate (91) is thicker than the module substrate (92).

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Inventors:
AIKAWA KIYOSHI (JP)
UEJIMA TAKANORI (JP)
KITAJIMA HIROMICHI (JP)
YAMADA TAKASHI (JP)
DAIMON YOSHIHIRO (JP)
Application Number:
PCT/JP2022/010862
Publication Date:
October 06, 2022
Filing Date:
March 11, 2022
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L25/00; H03F3/24; H04B1/00; H04B1/38
Domestic Patent References:
WO2020090557A12020-05-07
WO2020071021A12020-04-09
WO2020022180A12020-01-30
WO2019244816A12019-12-26
Foreign References:
JP2021048567A2021-03-25
JP2005203633A2005-07-28
JP2002359327A2002-12-13
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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