Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/215404
Kind Code:
A1
Abstract:
The present invention reduces degradation of characteristics. A high-frequency module (1) is provided with: a first power amplification circuit (2); a second power amplification circuit (3); and a substrate (7). The first power amplification circuit (2) includes a first amplification component (21) and a first transformer. The second power amplification circuit (3) includes a second amplification component (31) and a second transformer. The high-frequency module (1) is further provided with a long bump (8) disposed on one main surface of the substrate (7). The first amplification component (21) is disposed on one main surface of the substrate (7) via the long bump (8). The long bump (8) is positioned between the first transformer and the second transformer in a plan view in the thickness direction (D1) of the substrate (7).
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Inventors:
TAKAHASHI HIDETAKA
Application Number:
PCT/JP2022/009548
Publication Date:
October 13, 2022
Filing Date:
March 04, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/40; H03F1/02; H03F3/68; H03H7/38; H04B1/00
Domestic Patent References:
| WO2019049647A1 | 2019-03-14 |
Foreign References:
| JP2020126921A | 2020-08-20 | |||
| JP2014116844A | 2014-06-26 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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