Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/112577
Kind Code:
A1
Abstract:
The present invention addresses the problem of further increasing thermal insulation properties between a power amplifier and an electronic component. A high frequency module (1) comprises a mounting board (100), a power amplifier, an electronic component, and a resin layer. The power amplifier is disposed to either a first main surface (101) or a second main surface (102) of the mounting board (100). The electronic component is disposed to the main surface of the mounting board (100) to which the power amplifier is disposed. In a plan view from the thickness direction (D1) of the mounting board (100), the resin layer is disposed at least between the power amplifier and the electronic component. A groove (151) is formed in the resin layer. If the mounting board (100) is viewed from a direction orthogonal to the thickness direction (D1) of the mounting board (100), the groove (151) has a bottom section (1511) positioned between a third main surface (upper surface 61a) of the power amplifier and the main surface 101 of the mounting board (100).
Inventors:
ARIMA KEISUKE
KANI HIROYUKI
SATO TOMOAKI
KANI HIROYUKI
SATO TOMOAKI
Application Number:
PCT/JP2022/042320
Publication Date:
June 22, 2023
Filing Date:
November 15, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/29; H01L23/31; H01L23/34; H01L25/04; H01L25/18; H03H9/25
Domestic Patent References:
| WO2019167908A1 | 2019-09-06 | |||
| WO2019181589A1 | 2019-09-26 |
Foreign References:
| US20110006408A1 | 2011-01-13 | |||
| JP2018170419A | 2018-11-01 | |||
| JP2006190798A | 2006-07-20 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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