Title:
HIGH-FREQUENCY MODULE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2017/002775
Kind Code:
A1
Abstract:
The freedom of arrangement of mounted components is increased by providing a surface of a sealing resin layer with a step to reduce excess portions of a high frequency module, and by disposing a shield wall so as to intersect the step. A high frequency module 1a is provided with: a wiring substrate 2; a plurality of components 3a, 3b mounted on an upper surface 2a of the wiring substrate 2; a sealing resin layer 4 which is layered on the upper surface 2a of the wiring substrate 2 and which covers the plurality of components 3a, 3b; a groove 7 which is formed in an upper surface 4a of the sealing resin layer 4 and which passes between predetermined components 3a, 3b among the plurality of components 3a, 3b; and a shield wall 5 formed by means of a conductive paste in the groove 7, wherein a step is provided to form a high location and a low location on the upper surface 4a of the sealing resin layer 4, the groove 7 being disposed to intersect the step in a plan view of the wiring substrate 2.
Inventors:
MASUDA YOSHIHISA (JP)
KITA RYOICHI (JP)
YAMAMOTO ISSEI (JP)
NAKANISHI KATSUKI (JP)
NAKAZAWA YUKIO (JP)
KITA RYOICHI (JP)
YAMAMOTO ISSEI (JP)
NAKANISHI KATSUKI (JP)
NAKAZAWA YUKIO (JP)
Application Number:
PCT/JP2016/069066
Publication Date:
January 05, 2017
Filing Date:
June 28, 2016
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K9/00; H01L23/28; H01L25/04; H01L25/18; H05K1/02; H05K1/18; H05K3/28
Foreign References:
| JP2015053297A | 2015-03-19 | |||
| US20140146495A1 | 2014-05-29 | |||
| JP2010225620A | 2010-10-07 |
Attorney, Agent or Firm:
YANASE, Yuji et al. (JP)
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