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Title:
HIGH-FREQUENCY MODULE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2018/131452
Kind Code:
A1
Abstract:
[Problem] To prevent characteristic degradation due to a positional displacement between a waveguide and a backshort. [Solution] A high-frequency module 13 is provided with: a package part 6 comprising a semiconductor chip 1, a first portion 3A of a backshort 3, the first portion being integrated with the semiconductor chip by means of a first resin 2, and a first rewiring line 5 electrically connected to the semiconductor chip and including a portion serving as an antenna coupler 4; and a waveguide 7 with which a second portion 3B of the backshort 3 is integrated. The package part and the waveguide are integrated by means of a second resin 8 such that the portion serving as the antenna coupler is located between the waveguide and the backshort.

Inventors:
ISHIBASHI, Daijiro (1-1 Kamikodanaka 4-chome, Nakahara-ku, Kawasaki-sh, Kanagawa 88, 〒2118588, JP)
Application Number:
JP2017/046388
Publication Date:
July 19, 2018
Filing Date:
December 25, 2017
Export Citation:
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Assignee:
FUJITSU LIMITED (1-1 Kamikodanaka 4-chome, Nakahara-ku Kawasaki-sh, Kanagawa 88, 〒2118588, JP)
International Classes:
H01P5/107; H01L23/12; H01P11/00; H01Q13/02; H01L21/56
Foreign References:
JP2015149671A2015-08-20
JP2015177423A2015-10-05
US20150364830A12015-12-17
JP2015126289A2015-07-06
Attorney, Agent or Firm:
MUKOUYAMA Naoki (1-1 Kamikodanaka 4-chome, Nakahara-ku Kawasaki-sh, Kanagawa 88, 〒2118588, JP)
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