Title:
HIGH-FREQUENCY MODULE, AND METHOD FOR MANUFACTURING HIGH-FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2023/189210
Kind Code:
A1
Abstract:
In this invention, a support member covers a first component. The support member has a first surface. A wiring board is disposed non-parallel to the first surface, and at least a partial region of one surface is covered with the support member. A second component is mounted on the surface of the wiring board which is covered with the support member. The second component is also covered with the support member. A first external connection terminal connected to the first component is exposed on the first surface. A second external connection terminal is exposed on the first surface or disposed on a virtual plane extending from the first surface, and electrically connected to the second component.
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Inventors:
NEMOTO TAKAYA (JP)
UEDA HIDEKI (JP)
YOKOYAMA MICHIHARU (JP)
UEDA HIDEKI (JP)
YOKOYAMA MICHIHARU (JP)
Application Number:
PCT/JP2023/008088
Publication Date:
October 05, 2023
Filing Date:
March 03, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/38; H01Q23/00; H05K1/14; H05K1/18; H05K3/34; H05K3/36
Domestic Patent References:
| WO2020121984A1 | 2020-06-18 | |||
| WO2022004080A1 | 2022-01-06 | |||
| WO2019123995A1 | 2019-06-27 |
Attorney, Agent or Firm:
KITAYAMA Mikio et al. (JP)
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