Title:
HIGH FREQUENCY MODULE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2017/138299
Kind Code:
A1
Abstract:
This high frequency module is provided with: a first electronic component (1) that is embedded in an insulating layer (2); a wiring line (3) that is connected to the first electronic component (1); and a via conductor (4) that extends in the direction perpendicular to the main surface of the insulating layer (2) and has a first part (4a) and a second part (4b). The first part (4a) of the via conductor (4) is connected to the wiring line (3); and this high frequency module is configured such that the cross-sectional area of the first part (4a) of the via conductor (4) in the direction parallel to the main surface of the insulating layer (2) is different from the cross-sectional area of the second part (4b) of the via conductor (4) in the direction parallel to the main surface of the insulating layer (2).
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Inventors:
IWAMOTO TAKASHI (JP)
Application Number:
PCT/JP2017/001026
Publication Date:
August 17, 2017
Filing Date:
January 13, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25; H01L23/12; H03H3/08
Foreign References:
JP2014236387A | 2014-12-15 | |||
JP2001196643A | 2001-07-19 | |||
JP2006066517A | 2006-03-09 | |||
JP2007281902A | 2007-10-25 | |||
JP2015103888A | 2015-06-04 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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