Title:
HIGH-FREQUENCY MODULE, TRANSMISSION POWER AMPLIFIER, AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/090557
Kind Code:
A1
Abstract:
This high-frequency module (1A) comprises: a module substrate (70) having main surfaces (701 and 702); columnar electrodes (83c to 83g) arranged on the main surface (702); and a PA (11) disposed on the main surface (702). The PA (11) comprises: a main surface (101) closest to the main surface (702); a main surface (102) facing the main surface (101); an output electrode (11b) connected to the main surface (101) and transmitting a high-frequency signal output from the PA (11); and a ground electrode (11g1) connected to the main surface (102) and connected to an external substrate (90).
Inventors:
MATSUMOTO SHO (JP)
UEJIMA TAKANORI (JP)
TAKEMATSU YUJI (JP)
HARADA TETSURO (JP)
NAKAGAWA DAI (JP)
MATSUMOTO NAOYA (JP)
SASAKI YUTAKA (JP)
FUKUDA YUUKI (JP)
UEJIMA TAKANORI (JP)
TAKEMATSU YUJI (JP)
HARADA TETSURO (JP)
NAKAGAWA DAI (JP)
MATSUMOTO NAOYA (JP)
SASAKI YUTAKA (JP)
FUKUDA YUUKI (JP)
Application Number:
PCT/JP2019/041388
Publication Date:
May 07, 2020
Filing Date:
October 21, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/38; H01L25/00
Domestic Patent References:
WO2018110513A1 | 2018-06-21 | |||
WO2018043162A1 | 2018-03-08 | |||
WO2009122835A1 | 2009-10-08 | |||
WO2006035518A1 | 2006-04-06 |
Foreign References:
JP2003124435A | 2003-04-25 | |||
JP2018098677A | 2018-06-21 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
Download PDF: