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Title:
HIGH-FREQUENCY MODULE, TRANSMISSION POWER AMPLIFIER, AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/090557
Kind Code:
A1
Abstract:
This high-frequency module (1A) comprises: a module substrate (70) having main surfaces (701 and 702); columnar electrodes (83c to 83g) arranged on the main surface (702); and a PA (11) disposed on the main surface (702). The PA (11) comprises: a main surface (101) closest to the main surface (702); a main surface (102) facing the main surface (101); an output electrode (11b) connected to the main surface (101) and transmitting a high-frequency signal output from the PA (11); and a ground electrode (11g1) connected to the main surface (102) and connected to an external substrate (90).

Inventors:
MATSUMOTO SHO (JP)
UEJIMA TAKANORI (JP)
TAKEMATSU YUJI (JP)
HARADA TETSURO (JP)
NAKAGAWA DAI (JP)
MATSUMOTO NAOYA (JP)
SASAKI YUTAKA (JP)
FUKUDA YUUKI (JP)
Application Number:
PCT/JP2019/041388
Publication Date:
May 07, 2020
Filing Date:
October 21, 2019
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/38; H01L25/00
Domestic Patent References:
WO2018110513A12018-06-21
WO2018043162A12018-03-08
WO2009122835A12009-10-08
WO2006035518A12006-04-06
Foreign References:
JP2003124435A2003-04-25
JP2018098677A2018-06-21
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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