Title:
HIGH-FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2012/014643
Kind Code:
A1
Abstract:
The disclosed high-frequency module with a high degree of design freedom and excellent transmission characteristics is realized by a structure provided with balanced terminals. In multiple prescribed layers from the second layer (PL2) to the sixth layer (PL6) of a laminate body (900), wiring patterns (101, 102, 201, 202, 301, 302, 401, 402) are formed which connect to the respective balanced terminals of a SAW filter of a SAW duplexer (S1, S2). At that time, the characteristic impedances of the wiring patterns which are pairs of parallel circuits are matched: the characteristic impedances of the wiring patterns (101, 102) are matched, the characteristic impedances of the wiring patterns (201, 202) are matched, the characteristic impedances of the wiring patterns (301, 302) are matched, and the characteristic impedances of the wiring patterns (401, 402) are matched.
Inventors:
UEJIMA Takanori (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
Application Number:
JP2011/065432
Publication Date:
February 02, 2012
Filing Date:
July 06, 2011
Export Citation:
Assignee:
Murata Manufacturing Co., Ltd. (10-1, Higashikotari 1-chome Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
株式会社村田製作所 (〒55 京都府長岡京市東神足１丁目１０番１号 Kyoto, 〒6178555, JP)
株式会社村田製作所 (〒55 京都府長岡京市東神足１丁目１０番１号 Kyoto, 〒6178555, JP)
International Classes:
H03H9/25; H03H9/72; H04B1/40
Attorney, Agent or Firm:
Kaede Patent Attorneys' Office (1-4-34, Noninbashi Chuo-ku, Osaka-sh, Osaka 11, 〒5400011, JP)
Claims: