Title:
HIGH-FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2014/087792
Kind Code:
A1
Abstract:
A high-frequency module comprises a stack part (2), bottom face electrodes (4), and internal electrodes for grounding (32A, 33A, 34A, 35A). The bottom face electrodes (4) are for grounding, and are disposed upon the bottom face of the stack part (2). The stack part (2) further comprises wiring regions (10) wherethrough the wiring of a high-frequency circuit part passes. The respective internal electrodes for grounding (32A-35A) are disposed between respective layers of the stack part (2), are connected to the bottom face electrodes (4), and are formed from lines which have ends and which extend outside the wiring regions (10) along the outer edges of the stack part (2). When viewed in the stacking direction of the stack part (2), the internal electrodes for grounding (32A-35A) are mutually contiguous without ends.
Inventors:
WAKABAYASHI YUKI (JP)
Application Number:
PCT/JP2013/080189
Publication Date:
June 12, 2014
Filing Date:
November 08, 2013
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/46
Foreign References:
| JP2000040895A | 2000-02-08 | |||
| JPH0652191U | 1994-07-15 | |||
| JPH07240595A | 1995-09-12 | |||
| JPH03106097A | 1991-05-02 |
Attorney, Agent or Firm:
Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
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