Title:
HIGH-FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2017/169545
Kind Code:
A1
Abstract:
A high-frequency module is equipped with an insulative substrate (1), a mountable element (2), and a shield conductor (4). The mountable element (2) is an element mounted to the surface of the insulative substrate (1), and has a first terminal (transmission terminal (21), as one example) for mounting. The shield conductor (4) covers the mountable element (2) at a distance from the mountable element (2). The shield conductor (4) has an exposed section (opening (51), as one example) formed therein for exposing at least the first terminal. The straight-line distance from the first terminal to the exposed section is shorter than the straight-line distance from the first terminal to the shield conductor (4).
Inventors:
UEJIMA TAKANORI (JP)
Application Number:
PCT/JP2017/008870
Publication Date:
October 05, 2017
Filing Date:
March 07, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H7/46; H01L23/00; H04B1/04; H04B1/38; H05K9/00
Foreign References:
| JP3111672U | 2005-07-28 | |||
| JP2002094410A | 2002-03-29 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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