Title:
HIGH-FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2017/169547
Kind Code:
A1
Abstract:
The present invention improves the isolation between a plurality of terminals in a circuit that includes a mountable element. A high-frequency module (10) is equipped with a branch circuit element (20), a layering substrate (101), and a shield conductor (103). The branch circuit element (20) is equipped with a transmission terminal (211) and a receiving terminal (212), and is mounted to the surface of the layering substrate (101). The shield conductor (103) is positioned on the surface side of the layering substrate (101), and is shaped so as to cover the branch circuit element (20). The transmission terminal (211) and the receiving terminal (212) are positioned relative to the shield conductor (103) in locations where a signal in at least part of the frequency band of a first signal from the transmission terminal (211) is cancelled by a second signal in the receiving terminal (212).
Inventors:
UEJIMA TAKANORI (JP)
Application Number:
PCT/JP2017/008872
Publication Date:
October 05, 2017
Filing Date:
March 07, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/525; H01L23/00; H03H7/46
Foreign References:
| JP2008078321A | 2008-04-03 | |||
| JPH10107471A | 1998-04-24 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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