Title:
HIGH FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2018/052081
Kind Code:
A1
Abstract:
According to the present invention, a high frequency module is reduced in size by mounting a component on a wiring substrate in an upright manner, thereby reducing the mounting area. This high frequency module 1 is provided with: a wiring substrate 2; a plurality of components 3 that are mounted on an upper surface 2a and a lower surface 2b of the wiring substrate 2; a terminal component 4 and a conductive member 5, which are mounted on the lower surface 2b and function as an external connection terminal 11; a metal pin 6; and sealing resin layers 7a, 7b. The terminal component 4 is mounted on the wiring substrate 2 in an upright manner, so that a first external electrode thereof is connected to the lower surface 2b of the wiring substrate 2 but a second external electrode thereof is not connected to the wiring substrate 2. The conductive member 5 is laminated on the second external electrode side of the terminal component 4, and the terminal component 4 and the conductive member 5 integrally function as the external connection terminal 11 of the high frequency module 1.
Inventors:
DEGUCHI KAZUAKI (JP)
MATSUMOTO MITSUHIRO (JP)
KAMIO SHIGEYUKI (JP)
NOGUCHI AKIHIDE (JP)
SATO KAZUSHIGE (JP)
MASAOKA TSUYOSHI (JP)
AMACHI NOBUMITSU (JP)
MATSUMOTO MITSUHIRO (JP)
KAMIO SHIGEYUKI (JP)
NOGUCHI AKIHIDE (JP)
SATO KAZUSHIGE (JP)
MASAOKA TSUYOSHI (JP)
AMACHI NOBUMITSU (JP)
Application Number:
PCT/JP2017/033256
Publication Date:
March 22, 2018
Filing Date:
September 14, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L25/00; H05K3/28
Foreign References:
| JP2005203633A | 2005-07-28 | |||
| JP2010003800A | 2010-01-07 |
Attorney, Agent or Firm:
YANASE, Yuji et al. (JP)
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