Title:
HIGH-FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2018/101381
Kind Code:
A1
Abstract:
Provided is a high-frequency module that makes it possible to improve the shielding of a specific component. A high-frequency module 1a in which a component 3c that is mounted on an upper surface 20a of a multilayer wiring board 2 is surrounded by: a shielding film 6 that coats the surface of a sealing resin layer 4; a plurality of metal pins 5a that are arrayed in the sealing resin layer 4 to surround the component 3c; an external electrode 8c that is formed on a lower surface 20b of the multilayer wiring board 2 in a position that, as seen from a direction that is orthogonal to the upper surface 20a of the multilayer wiring board 2, coincides with the component 3c; and a plurality of connection conductors (a via conductor 10b, a pad electrode 11) that connect the metal pins 5a and the external electrode 8c.
Inventors:
OTSUBO YOSHIHITO (JP)
Application Number:
PCT/JP2017/042965
Publication Date:
June 07, 2018
Filing Date:
November 30, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01L23/28; H05K9/00
Domestic Patent References:
| WO2016181954A1 | 2016-11-17 |
Foreign References:
| US20120217048A1 | 2012-08-30 | |||
| US20120228751A1 | 2012-09-13 | |||
| JP2012019091A | 2012-01-26 |
Attorney, Agent or Firm:
YANASE, Yuji et al. (JP)
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