Title:
HIGH FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2018/168653
Kind Code:
A1
Abstract:
An amplifying circuit section (40) of a high frequency module (1) is mounted on a substrate (10) via a first external terminal (41), a switch circuit section (20) is mounted on the substrate (10) via a second external terminal (22), and a matching circuit section (30) is mounted on the substrate (10) via a first terminal (31) and a second terminal (32). The first terminal (31) is electrically connected to the second external terminal (22) of the switch circuit section (20), and the second terminal (32) is electrically connected to the first external terminal (41) of the amplifying circuit section (40). When viewed from the direction perpendicular to one main surface (10a) of the substrate (10), the first terminal (31) and the second external terminal (22) of the switch circuit section (20) overlap each other, and the second terminal (32) and the first external terminal (41) of the amplifying circuit section (40) overlap each other.
Inventors:
WATANABE TAKASHI (JP)
Application Number:
PCT/JP2018/009052
Publication Date:
September 20, 2018
Filing Date:
March 08, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L25/00; H01L23/12; H04B1/40
Domestic Patent References:
| WO2014171225A1 | 2014-10-23 |
Foreign References:
| JP2004111938A | 2004-04-08 | |||
| JP2009177040A | 2009-08-06 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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