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Patent Searching and Data


Title:
HIGH FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2018/186065
Kind Code:
A1
Abstract:
Disclosed is a high frequency module wherein a ground plane is provided inside or on the upper surface of a dielectric substrate. A high frequency semiconductor element is mounted on the bottom surface of the dielectric substrate. A shield structure disposed in a space on the side further toward the bottom surface than the ground plane surrounds the high frequency semiconductor element from below and sides of the high frequency semiconductor element, and is connected to the ground plane. An opening is provided in the shield structure. A radiation structure section radiates, as electromagnetic waves, high frequency signals through the opening, said high frequency signals having been outputted from the high frequency semiconductor element.

Inventors:
UEDA HIDEKI (JP)
Application Number:
PCT/JP2018/007632
Publication Date:
October 11, 2018
Filing Date:
February 28, 2018
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01Q23/00; H01L23/00; H01Q5/378; H01Q13/08; H01Q13/10
Foreign References:
JPH11266172A1999-09-28
JP2011517394A2011-06-02
JP2001251118A2001-09-14
JP2004165854A2004-06-10
JP2013179152A2013-09-09
JP2005051576A2005-02-24
JPS4984766A1974-08-14
JP2003188639A2003-07-04
Attorney, Agent or Firm:
KITAYAMA, Mikio et al. (JP)
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