Title:
HIGH FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2019/004332
Kind Code:
A1
Abstract:
The purpose of the present invention is to reduce damage to a wiring board due to the provision of an inter-components shield, while maintaining the characteristics of the inter-components shield. A high frequency module 1a is provided with: a wiring board 2; a plurality of components 3a to d mounted on an upper surface 2a of the wiring board 2; a shield component 4 mounted between a component 3b and a component 3c; a sealing resin layer 5 which coats the components 3a to 3d and the shield component 4; and a shield film 6 which coats a surface of the sealing resin layer. An upper surface 5a of the sealing resin layer 5 is formed with a recess 10 in which the shield component 4 is exposed. The recess 10 is formed on the inside of an edge so as to not reach a side surface of the sealing resin layer 5. The shield film 6 coats a wall surface 10a of the recess 10 and further coats a portion of the shield component 4 that is exposed through the recess 10.
Inventors:
NOMURA TADASHI (JP)
MORIMOTO YUTA (JP)
KOMIYAMA MINORU (JP)
KATSUBE AKIO (JP)
MORIMOTO YUTA (JP)
KOMIYAMA MINORU (JP)
KATSUBE AKIO (JP)
Application Number:
PCT/JP2018/024497
Publication Date:
January 03, 2019
Filing Date:
June 28, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01L23/28; H01L25/04; H01L25/18; H05K3/28; H05K9/00
Domestic Patent References:
| WO2016195026A1 | 2016-12-08 |
Foreign References:
| JP2011187677A | 2011-09-22 | |||
| JP5988003B1 | 2016-09-07 | |||
| JP2010087058A | 2010-04-15 | |||
| JP2015057804A | 2015-03-26 |
Attorney, Agent or Firm:
YANASE, Yuji et al. (JP)
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