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Patent Searching and Data


Title:
HIGH-FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2019/049647
Kind Code:
A1
Abstract:
The purpose of the present invention is to improve communication performance. A substrate (2) has a conductor part (23) to which constant potential is applied. A first communication part (3) transmits a first signal in a first frequency band. A second communication part (4) performs transmission of a second signal in a second frequency band which has higher frequencies than the first frequency band and which at least some of harmonics of the first signal overlap and/or reception of a third signal in the second frequency band. A first end (51) and a second end (52) of an electrically conductive wire (5) are connected to the conductor part (23). The second communication part (4) has at least one of a transmission filter that allows passage of the second signal, a reception filter that allows passage of the third signal, and a low noise amplifier that amplifies the third signal. The electrically conductive wire (5) is located between a power amplifier in the first communication part (3) and at least one of the transmission filter, the reception filter and the low noise amplifier in the second communication part (4).

Inventors:
MATSUMOTO, Naoya
Application Number:
JP2018/030701
Publication Date:
March 14, 2019
Filing Date:
August 20, 2018
Export Citation:
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Assignee:
MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-chome Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
International Classes:
H04B1/525; H03H7/38; H04B1/00
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (Umeda Square Bldg, 9F. 1-12-17, Umeda, Kita-ku, Osaka-sh, Osaka 01, 〒5300001, JP)
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