Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HIGH-FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2019/216300
Kind Code:
A1
Abstract:
Provided is a high-frequency module for which the linear expansion coefficient, glass transition temperature, and elastic modulus of a sealing resin layer are adjusted such that warping does not easily occur. A high-frequency module 1a is provided with: a wiring substrate 2; a first component 3a mounted to a lower surface 2a of the wiring substrate 2; a plurality of connection terminals 4; a first sealing resin layer 5 that covers the first component 3a and the connection terminals 4; a plurality of second components 3b mounted to an upper surface 2b of the wiring substrate 2; a second sealing resin layer 6 that covers the second components 3b; and a shield film 7. The first sealing resin layer 5 is formed having a thickness that is thinner than that of the second sealing resin layer 6, and the linear expansion coefficient of the resin of the first sealing resin layer 5 is smaller than the linear expansion coefficient of the resin of the second sealing resin layer 6. Furthermore, the glass transition temperature of the resin of the first sealing resin layer 5 is higher than the glass transition temperature of the resin of the second sealing resin layer 6, and/or the elastic modulus of the resin of the first sealing resin layer 5 is greater than the elastic modulus of the resin of the second sealing resin layer 6.

More Like This:
JP3909181SEMICONDUCTOR DEVICE
JP2009215520EPOXY RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR AND OPTICAL SEMICONDUCTOR DEVICE
JP4591297Semiconductor device mounting structure and semiconductor device mounting method
Inventors:
NOMURA TADASHI (JP)
KUSUYAMA TAKAFUMI (JP)
Application Number:
PCT/JP2019/018207
Publication Date:
November 14, 2019
Filing Date:
May 07, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/29; H01L23/00; H01L23/28; H01L23/31; H05K3/00; H05K3/28; H05K9/00
Domestic Patent References:
WO2014017159A12014-01-30
WO2013035715A12013-03-14
Foreign References:
JP2005203633A2005-07-28
JP2010118649A2010-05-27
JPH05275417A1993-10-22
Attorney, Agent or Firm:
YANASE, Yuji et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: METHOD FOR MANUFACTURING HIGH-FREQUENCY MODULE, AND HIGH-FREQUENCY MODULE

Next Patent: POLISHING PAD AND POLISHING METHOD WITH USE OF SAID POLISHING PAD