Title:
HIGH-FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2020/121815
Kind Code:
A1
Abstract:
The present invention is provided with a plurality of waveguide structures 12 loaded on a top surface 11U that faces a bottom surface 11B of a metal case 11, said bottom surface 11B having a high-frequency circuit mounted thereon. The height dimension of each of these waveguide structures 12 corresponds to a quarter wavelength at a cutoff frequency fo, which indicates the frequency band of a target electromagnetic wave to be cut off. The width and the length of each of these waveguide structures 12 have dimensions at which only a high frequency in a TE10 mode can be propagated in the frequency band of the target electromagnetic wave. By doing so, unwanted electromagnetic waves propagating through the interior of the metal case can be cut off without using an electromagnetic wave absorber.
Inventors:
HAMADA HIROSHI (JP)
NOSAKA HIDEYUKI (JP)
NOSAKA HIDEYUKI (JP)
Application Number:
PCT/JP2019/046371
Publication Date:
June 18, 2020
Filing Date:
November 27, 2019
Export Citation:
Assignee:
NIPPON TELEGRAPH & TELEPHONE (JP)
International Classes:
H01P1/209; H03F3/60; H05K9/00
Foreign References:
| JP2010252182A | 2010-11-04 | |||
| JP2003258504A | 2003-09-12 | |||
| US20140132153A1 | 2014-05-15 |
Attorney, Agent or Firm:
YAMAKAWA, Shigeki et al. (JP)
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