Title:
HIGH-FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2023/021982
Kind Code:
A1
Abstract:
A high-frequency module (1A) comprises: a module substrate (90) having major surfaces (90a and 90b) opposite each other; a plurality of electronic components disposed on the major surface (90a) and on the major surface (90b); and a power supply terminal (134) disposed on the major surface (90b). The plurality of electronic components include an integrated circuit (80) disposed on the major surface (90b) and including a control circuit (81) connected to the power supply terminal (134), and a capacitor (74) disposed on the major surface (90b) and connected between a path connecting the power supply terminal (134) and the control circuit (81) and ground. Specifically, the integrated circuit (80) is disposed closer to the capacitor (74) than any of the other electronic components disposed on the major surface (90b), and/or the capacitor (74) is disposed closer to the integrated circuit (80) than any of the other electronic components disposed on the major surface (90b).
Inventors:
YAMAGUCHI YUKIYA (JP)
HORITA ATSUSHI (JP)
SHOUNAI HIROKI (JP)
HORITA ATSUSHI (JP)
SHOUNAI HIROKI (JP)
Application Number:
PCT/JP2022/029629
Publication Date:
February 23, 2023
Filing Date:
August 02, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/38; H01L25/00; H01L25/065; H01L25/07; H01L25/18; H04B1/00
Foreign References:
| JP2013085290A | 2013-05-09 | |||
| JP2014090399A | 2014-05-15 | |||
| CN112751580A | 2021-05-04 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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