Title:
HIGH FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2023/233843
Kind Code:
A1
Abstract:
The present invention suppresses degradation in characteristics while achieving size reduction. In a high frequency module (100), a first chip (4) includes at least one of a plurality of first elastic wave resonators (14) of a first filter (1), and is disposed on a mounting board (9). A second chip (5) includes at least one of a plurality of second elastic wave resonators (24) of a second filter (2). The second chip (5) is disposed on the opposite side to the mounting board (9) side of the first chip (4). The first chip (4) has a first main surface (41) on the second chip (5) side, and a second main surface (42) on the mounting board (9) side. The second chip (5) has a third main surface (51) on the first chip (4) side, and a fourth main surface (52) on the opposite side to the first chip (4) side. A first circuit element related to the first filter (1) is disposed on the second main surface (42) side of the first chip (4). A second circuit element related to the second filter (2) is mounted on the fourth main surface (52) side of the second chip (5).
Inventors:
KUROYANAGI TAKUMA
ITO TAKANORI
TAKAHASHI HIDETAKA
KANI HIROYUKI
ITO TAKANORI
TAKAHASHI HIDETAKA
KANI HIROYUKI
Application Number:
PCT/JP2023/015275
Publication Date:
December 07, 2023
Filing Date:
April 17, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25; H03H9/64; H03H9/72
Domestic Patent References:
| WO2018123447A1 | 2018-07-05 | |||
| WO2018143044A1 | 2018-08-09 | |||
| WO2022102197A1 | 2022-05-19 |
Foreign References:
| JP2019186726A | 2019-10-24 | |||
| JP2022072241A | 2022-05-17 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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