HIGH-FREQUENCY PACKAGE

WIPO Patent Application WO/2012/140934

A1

A high-frequency package (100) according to an embodiment is provided with: a first dielectric substrate (10) having signal wiring and a ground conductor (30) provided to the reverse surface; a high-frequency element (20) connected to the reverse surface of the first dielectric substrate via a first connection conductor (40); a second dielectric substrate (11) having signal wiring and a ground conductor (30) provided to the obverse surface, which faces the aforementioned reverse surface with the high-frequency element positioned therebetween; and a plurality of second connecting conductors (41) arranged so as to surround the high-frequency element, the second connecting conductors providing a connection between the ground conductor on the reverse surface of the first dielectric substrate and the ground conductor on the obverse surface of the second dielectric substrate. The high-frequency package (100) according to the embodiment has a dielectric space (60), which is surrounded by a conductor pattern, formed on the obverse surface of the second dielectric substrate under the high-frequency element.

JP2002252299	PACKAGE FOR STORING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
JP2002280482	SEMICONDUCTOR DEVICE FOR MICROWAVE

KITSUKAWA YUSUKE (JP)
SUZUKI TAKUYA (JP)
UNNO TOMOYUKI (JP)

PCT/JP2012/052117

October 18, 2012

January 31, 2012

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MITSUBISHI ELECTRIC CORP (JP)
KITSUKAWA YUSUKE (JP)
SUZUKI TAKUYA (JP)
UNNO TOMOYUKI (JP)

H01L23/02; H01L23/04

WO2007058280A1	2007-05-24
WO2010026990A1	2010-03-11

JP2006210530A	2006-08-10
JP2001135775A	2001-05-18
JP2010258137A	2010-11-11
JP2003163304A	2003-06-06

See also references of EP 2698819A4

SAKAI, HIROAKI (JP)
Hiroaki Sakai (JP)

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