Title:
HIGH-FREQUENCY PACKAGE
Document Type and Number:
WIPO Patent Application WO/2013/133122
Kind Code:
A1
Abstract:
The present invention is provided with: an MMIC (3) having a signal source (4) and a conductor pattern (33) connected to the signal source (4); a substrate on which a signal line and a GND are formed and onto which the MMIC (3) is mounted; signaling-use metal bumps (21) that are formed between the MMIC (3) and the substrate and connect the conductor pattern (33) of the MMIC (3) and the signal line of the substrate; and a plurality of shielding-use metal bumps (22), which are formed between the MMIC (3) and the substrate so as to surround the signal source (4) and the conductor pattern (33) together with the signaling-sue metal bumps (21), and between which the interval, inclusive of the interval with the signaling-use metal bumps (21), is a half wavelength or less of the electromagnetic waves emitted by the signal source (4).
Inventors:
YASOOKA KOSUKE (JP)
Application Number:
PCT/JP2013/055410
Publication Date:
September 12, 2013
Filing Date:
February 28, 2013
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
YASOOKA KOSUKE (JP)
YASOOKA KOSUKE (JP)
International Classes:
H05K9/00; H01L23/02; H01P3/16
Foreign References:
| JP2001257286A | 2001-09-21 | |||
| JP3066855U | 2000-03-07 | |||
| JPH0864983A | 1996-03-08 | |||
| JP2006203261A | 2006-08-03 |
Attorney, Agent or Firm:
SAKAI, HIROAKI (JP)
Hiroaki Sakai (JP)
Hiroaki Sakai (JP)
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