Title:
HIGH FREQUENCY POWER CIRCUIT MODULE
Document Type and Number:
WIPO Patent Application WO/2019/009062
Kind Code:
A1
Abstract:
This high frequency power circuit module (101) is provided with: an electronic circuit board (1) having a bent portion; a high frequency power circuit formed on the electronic circuit board (1); a battery (3) connected to the high frequency power circuit; and a magnetic body sheet (4) having an area larger than that of the battery (3). The battery (3) is covered with the magnetic body sheet (4) in a state in which the bent portion (BS) of the electronic circuit board (1) is bent. The high frequency power circuit, the battery (3), and the magnetic body sheet (4) are thermally coupled to each other by means of a resin sealing body (5) which is a material having thermal resistance lower than that of air.
Inventors:
HOSOTANI TATSUYA (JP)
Application Number:
PCT/JP2018/023277
Publication Date:
January 10, 2019
Filing Date:
June 19, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K7/20; H01L23/29; H01L25/065; H01L25/07; H01L25/18; H01Q7/00; H01Q23/00; H02J7/00; H02J50/10; H05K1/02; H05K3/28
Domestic Patent References:
| WO2010131524A1 | 2010-11-18 | |||
| WO2012036139A1 | 2012-03-22 |
Foreign References:
| JP2016039337A | 2016-03-22 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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