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Patent Searching and Data


Title:
HIGH-FREQUENCY PRINTED CIRCUIT BOARD AND WIRING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2014/192322
Kind Code:
A1
Abstract:
(1) A conductor layer is layered on at least one surface of a dielectric layer, and the dielectric layer is provided with an intermediate layer and at least one pair of fluororesin layers on both sides of the intermediate layer, the ratio of the total average thickness of the intermediate layer to the total average thickness of the fluororesin layers being from 0.001 to 30, the relative permittivity of the intermediate layer being from 1.2 to 10, the linear expansion coefficient of the intermediate layer being -1×10–4 to 5×10–5/°C, and the adhesive strength between the fluororesin layer and the conductor layer being at least 300 g/cm. (2) Provided are a fluororesin dielectric layer and a conductor layer on both sides of the dielectric layer, at least one of the conductor layers constituting a wiring pattern, the average width of the wiring being 25-300 µm, the average thickness of the dielectric layer in the region where the wiring is layered being 5-125 µm, and the ratio of the average width of the wiring to the average thickness of the dielectric layer being 2.4 to 30. (3) The present invention has a multilayered structure in which conductor layers and fluororesin dielectric layers are alternatingly stacked, the fluororesin of the dielectric layers being cross-linked and chemically bonded with the conductor layers, the average thickness of the multilayer structure being 30-2000 µm, and the crushing resistance of the multilayer structure in a loop stiffness test being 0.1-20,000 N/cm.

Inventors:
KOUCHI MASAHIKO (JP)
MURATA KAZUO (JP)
NAKABAYASHI MAKOTO (JP)
Application Number:
PCT/JP2014/050643
Publication Date:
December 04, 2014
Filing Date:
January 16, 2014
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELEC PRINTED CIRCUITS (JP)
International Classes:
H05K1/03; B32B15/08; B32B15/082
Domestic Patent References:
WO2012161162A12012-11-29
WO2009147956A12009-12-10
Foreign References:
JPH06344503A1994-12-20
JPH0569442A1993-03-23
JP2004025835A2004-01-29
JPH05291711A1993-11-05
Attorney, Agent or Firm:
NAKATA, Motomi et al. (JP)
Nakada Motoki (JP)
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