Title:
HIGH FREQUENCY RELAY
Document Type and Number:
WIPO Patent Application WO/2018/168134
Kind Code:
A1
Abstract:
A high frequency relay (1) is provided with: an external housing (10) having insulation properties; a relay body (20) having an electromagnet part (22) and a contact mechanism part (23); and a shield member (30). The relay body (20) has plate-like relay terminals (25, 26, 27), and the relay terminals (25, 26, 27) are disposed such that plate surfaces thereof extend along second surfaces (212, 213, 214, 215) of the relay body (20) and one plate surface of each of the relay terminals (25, 26, 27) is exposed from at least one of the second surfaces (212, 213, 214, 215). At the second surfaces (212, 213, 214, 215), an insulation part (40), which is able to insulate the relay terminals (25, 26, 27) and the shield member (30) from each other, is provided between the plate surfaces of the relay terminals (25, 26, 27) and the shield member (30).
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Inventors:
TSURUSU TETSURO (JP)
ABE MASAAKI (JP)
OKUBO TSUYOSHI (JP)
HONDA YUKI (JP)
ABE MASAAKI (JP)
OKUBO TSUYOSHI (JP)
HONDA YUKI (JP)
Application Number:
PCT/JP2017/044906
Publication Date:
September 20, 2018
Filing Date:
December 14, 2017
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
H01H50/10; H01H50/14
Foreign References:
| JPH11144592A | 1999-05-28 | |||
| JPH10199388A | 1998-07-31 | |||
| JPS56100852U | 1981-08-08 |
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
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