Title:
HIGH-FREQUENCY SIGNAL WIRE PATHS, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/080887
Kind Code:
A1
Abstract:
Provided are high-frequency signal wire paths capable of suppressing the offset of the position relationship between the signal wire and an opening in the ground conductor from the specified position relationship, a manufacturing method thereof, and an electronic device. A dielectric body (12) is composed of layers of dielectric sheets (18a, 18b). The signal wires (20) are formed on the surface of a dielectric sheet (18b). An auxiliary ground conductor (24) is formed on the back surface of the dielectric sheet (18b) for forming the signal wires (20). Openings (30) overlapping the signal wires (20) are provided. A reference ground conductor (22) is provided on the front surface of the dielectric sheet (18a) and is opposite the auxiliary ground conductor (24) and sandwiches the signal wires (20).
Inventors:
KATO NOBORU (JP)
Application Number:
PCT/JP2012/080329
Publication Date:
June 06, 2013
Filing Date:
November 22, 2012
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/02; H05K3/46
Foreign References:
| JP2007123740A | 2007-05-17 | |||
| JP2009105207A | 2009-05-14 | |||
| JP2011061059A | 2011-03-24 | |||
| JP2010135830A | 2010-06-17 | |||
| JPH08265014A | 1996-10-11 | |||
| JP2011071403A | 2011-04-07 | |||
| JP2011138862A | 2011-07-14 |
Attorney, Agent or Firm:
PROFIC PC (JP)
Patent business corporation pro フィック patent firm (JP)
Patent business corporation pro フィック patent firm (JP)
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