Title:
HIGH-FREQUENCY WIRING STRUCTURE, HIGH-FREQUENCY MOUNTING SUBSTRATE, METHOD FOR PRODUCING HIGH-FREQUENCY WIRING STRUCTURE, AND METHOD FOR SHAPING WAVEFORM OF HIGH-FREQUENCY SIGNAL
Document Type and Number:
WIPO Patent Application WO/2013/183318
Kind Code:
A1
Abstract:
[Problem] To reduce distortions in signals on a plurality of transmission lines between which crosstalk may occur, and noise caused by crosstalk. [Solution] Each of a plurality of wiring patterns (2, 3) formed on a high-frequency wiring structure (1) is made by continuously joining together a plurality of segments each having a specific characteristic impedance and segment length. Of the plurality of adjacently arranged wiring patterns, two adjacent wiring patterns are arranged within a distance in which noise caused by crosstalk is generated. The characteristic impedance and the segment length of each of the segments included in each of the wiring patterns are determined such that reflected waves generated at the boundaries between two adjacent segments are superimposed upon the noise so as to cancel one another out and thereby the waveforms of signals propagating through a plurality of transmission lines are shaped.
Inventors:
YASUNAGA MORITOSHI (JP)
Application Number:
PCT/JP2013/052019
Publication Date:
December 12, 2013
Filing Date:
January 30, 2013
Export Citation:
Assignee:
UNIV TSUKUBA (JP)
International Classes:
H03K5/125; H01L21/82; H01L21/822; H01L27/04; H01P3/08; H01P5/02; H01P5/18; H05K1/02; H05K3/46
Foreign References:
| JP2005150644A | 2005-06-09 | |||
| JP2003134177A | 2003-05-09 | |||
| JP2008294837A | 2008-12-04 | |||
| JP2006270935A | 2006-10-05 | |||
| JP2007128339A | 2007-05-24 |
Attorney, Agent or Firm:
KATSUNUMA Hirohito et al. (JP)
Katsunuma Hirohito (JP)
Katsunuma Hirohito (JP)
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