Title:
HIGH-HARDNESS PHOTOSENSITIVE RESIN COMPOSITION FOR USE IN STEREOLITHOGRAPHY
Document Type and Number:
WIPO Patent Application WO/2019/075985
Kind Code:
A1
Abstract:
The present invention discloses a high-hardness photosensitive resin composition for use in stereolithography, comprising the following components: an epoxy resin with a content of 25-60%, an acrylate oligomer with a content of 15-45%, an acrylate monomer with a content of 15-35%, an inorganic filler with a content of 1-10%, a toughening agent with a content of 5-20%, a radical photoinitiator with a content of 1-8%, and a cationic photoinitiator with a content of 1-8%, the sum of the weight percentages of the above components being 100%. Workpieces prepared by the present invention have high hardness and high strength and can maintain high-temperature resistance. The present invention meets a need in the market for high-hardness resins.
Inventors:
ZENG JINLIANG (CN)
OUYANG LIWEI (CN)
OUYANG LIWEI (CN)
Application Number:
PCT/CN2018/078547
Publication Date:
April 25, 2019
Filing Date:
March 09, 2018
Export Citation:
Assignee:
ZHONGSHAN GREATSIMPLE TECH CO LTD (CN)
International Classes:
C08F283/10; C08F220/32; C08F220/34; C08K3/22; C08K3/34
Domestic Patent References:
| WO2015080159A1 | 2015-06-04 |
Foreign References:
| CN107722193A | 2018-02-23 | |||
| CN106749986A | 2017-05-31 | |||
| CN106977665A | 2017-07-25 | |||
| CN106986971A | 2017-07-28 | |||
| CN106749987A | 2017-05-31 | |||
| CN106751349A | 2017-05-31 | |||
| CN105237689A | 2016-01-13 | |||
| KR20160043792A | 2016-04-22 |
Attorney, Agent or Firm:
ZHONGSHAN KECHUANG PATENT AGENT CO., LTD (CN)
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