Title:
A HIGH HEAT DISSIPATION LED LIGHT SOURCE MODULE AND A HIGH HEAT DISSIPATION AND HIGH POWER LED LIGHT SOURCE ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2009/094829
Kind Code:
A1
Abstract:
A high heat dissipation LED light source module (1) includes a flip-chip LED light
source and a high heat conduction insulating sheet (12). The flip-chip LED light
source includes a heat dissipation base (112). The high heat conduction insulating
sheet (12) is directly connected with the bottom surface of the heat dissipation
base (112).The thermal conductivity of the insulating sheet (12) is between
170 and 237w/ (m Œk). A high heat dissipation and high power LED light source
assembly includes a connection board (2), a heat sink (3) and a plurality of LED
light sources.
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Inventors:
SHE, Jie (1601-1604#, Hui Jie Plaza No.268 Zhongshan Roa, Nanjing Jiangsu 8, 210008, CN)
Application Number:
CN2008/002028
Publication Date:
August 06, 2009
Filing Date:
December 18, 2008
Export Citation:
Assignee:
SHE, Jie (1601-1604#, Hui Jie Plaza No.268 Zhongshan Roa, Nanjing Jiangsu 8, 210008, CN)
International Classes:
H01L23/34; H01L23/36; H01L23/367; H01L33/64
Attorney, Agent or Firm:
ADVANCE CHINA I.P. LAW OFFICE (Suite 918-920, 9/F. DongShan Plaza, No.69 Xianlie Central Roa, Guangzhou Guangdong 5, 510095, CN)
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