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Title:
HIGH-MELT-VISCOSITY POLYAMIDE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/086289
Kind Code:
A1
Abstract:
The present invention provides a polyamide resin composition having a high melt viscosity, which is able to be molded by extrusion molding, blow molding, expansion molding or the like in addition to exhibiting good thermal aging resistance that is capable of withstanding a high temperature environment at around 200°C. This polyamide resin composition contains, per 100 parts by mass of a polyamide resin, 0.5-20 parts by mass of a metal cyanide salt represented by general composition formula (Ax[M(CN)y]), 2-30 parts by mass of a thickening agent and 0-140 parts by mass of an inorganic reinforcing material. In the general composition formula, M represents a specific transition metal element, and A represents an alkali metal or an alkaline earth metal.

Inventors:
YOSHIMURA NOBUHIRO (JP)
ITO TOMOHIRO (JP)
FUKUMOTO YUHEI (JP)
IWAMURA KAZUKI (JP)
Application Number:
PCT/JP2016/083757
Publication Date:
May 26, 2017
Filing Date:
November 15, 2016
Export Citation:
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Assignee:
TOYO BOSEKI (JP)
International Classes:
C08K3/00; C08L77/00; C08K5/315
Foreign References:
JP2012500305A2012-01-05
JP2012136621A2012-07-19
JP2011256290A2011-12-22
JPS62290759A1987-12-17
JP2013213091A2013-10-17
JP2003509578A2003-03-11
JP2013010087A2013-01-17
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