HIGH-MOLECULAR-WEIGHT COMPOUND CONTAINING CARBOXYLIC ACID GROUP, AND ADHESIVE AGENT COMPOSITION CONTAINING SAME

WIPO Patent Application WO/2018/105543

A1

The purpose of the present invention is to provide an adhesive agent composition which has highly superior wet heat resistance and can be applied to a lead-free solder under high humidity conditions while keeping the good adhesiveness thereof to various plastic films, metals such as copper, aluminum and stainless steel and a glass epoxy. A high-molecular-weight compound containing a carboxylic acid group, which contains, as copolymerization components, at least a high-molecular-weight polyol (A) having a number average molecular weight (Mn1) of 7,000 or more, a high-molecular-weight polyol (B) different from the high-molecular-weight polyol (A) and having a number average molecular weight (Mn2) of 1,000 or more, and a tetracarboxylic dianhydride, wherein the following requirements (1) to (2) are satisfied: (1) the number average molecular weight (Mn1) of the high-molecular-weight polyol (A) is largest among the copolymerization components; and (2) the number average molecular weight (Mn3) of the high-molecular-weight compound containing a carboxylic acid group is up to 1.7 times larger than the number average molecular weight (Mn1) of the high-molecular-weight polyol (A).

SHIBA TAKUYA (JP)
ITO TAKESHI (JP)

PCT/JP2017/043420

June 14, 2018

December 04, 2017

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TOYO BOSEKI (JP)

C08G63/91; C08G63/12; C09J7/00; C09J167/00; H05K3/38

JP2006137793A	2006-06-01
JPH02138333A	1990-05-28
JP2010013527A	2010-01-21
JPH1069126A	1998-03-10
JPH05287068A	1993-11-02

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