Title:
HIGH-MOLECULAR-WEIGHT COPOLYMER
Document Type and Number:
WIPO Patent Application WO/2011/016226
Kind Code:
A1
Abstract:
Provided is a copolymer for cured products which exhibits satisfactory characteristics (such as tight adhesion) as an adhesive for use in stacking semiconductor chips, or the like. The copolymer is characterized by comprising repeating units represented by general formulae (I), (II) and (III) and having a weight-average molecular weight of 50,000 to 200,000. In general formulae (I), (II) and (III), R1, R2 and R3 are each independently a hydrogen atom or a methyl group; R4 is an alkyl group or a cycloalkyl group; R5 is a hydrogen atom or a C1-6 alkyl group; and m, n and k represent the molar ratios respective of the repeating units, and m is a positive number of 0 or more but below 1, while n and k are each independently positive numbers, with the proviso that m, n and k satisfy the relationship: m + n + k = 1.
Inventors:
TAKAHASHI EIJI (JP)
MARUMO SHINJI (JP)
MISHIMA GOU (JP)
MARUMO SHINJI (JP)
MISHIMA GOU (JP)
Application Number:
PCT/JP2010/004894
Publication Date:
February 10, 2011
Filing Date:
August 04, 2010
Export Citation:
Assignee:
NIPPON SODA CO (JP)
TAKAHASHI EIJI (JP)
MARUMO SHINJI (JP)
MISHIMA GOU (JP)
TAKAHASHI EIJI (JP)
MARUMO SHINJI (JP)
MISHIMA GOU (JP)
International Classes:
C08F212/14; C08F220/10; C08F297/00
Domestic Patent References:
| WO2008026401A1 | 2008-03-06 |
Foreign References:
| JP2002047322A | 2002-02-12 | |||
| JPH11167206A | 1999-06-22 | |||
| JPH07209868A | 1995-08-11 | |||
| JP2007246600A | 2007-09-27 | |||
| JP2001139626A | 2001-05-22 | |||
| JPH10168132A | 1998-06-23 | |||
| JP2001139647A | 2001-05-22 | |||
| JP2009181210A | 2009-08-13 |
Other References:
See also references of EP 2447291A4
Attorney, Agent or Firm:
HIROTA, Masanori (JP)
Masaki Hirota (JP)
Masaki Hirota (JP)
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