HIGH PERFORMANCE THERMAL INTERFACE MATERIALS WITH LOW THERMAL IMPEDANCE

Title:

HIGH PERFORMANCE THERMAL INTERFACE MATERIALS WITH LOW THERMAL IMPEDANCE

Document Type and Number:

WIPO Patent Application WO/2016/086410

Kind Code:

A1

Abstract:

A thermal interface material includes, in one exemplary embodiment, a polymer, a phase change material, a first thermally conductive filler having a first particle size, and a second thermally conductive filler having a second particle size. The first particle size is larger than the second particle size. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.

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Inventors:

ZHANG BRIGHT (US)
SHEN LING (US)
WANG HUI (US)
LIU YA QUN (US)
WANG WEI JUN (US)
HUANG HONG MIN (US)

Application Number:

PCT/CN2014/093138

Publication Date:

June 09, 2016

Filing Date:

December 05, 2014

Export Citation:

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Assignee:

HONEYWELL INT INC (US)
ZHANG BRIGHT (US)
SHEN LING (US)
WANG HUI (US)
LIU YA QUN (US)
WANG WEI JUN (US)
HUANG HONG MIN (US)

International Classes:

C09K5/14

Domestic Patent References:

WO2001020618A1	2001-03-22
WO2004008497A2	2004-01-22
WO2007027670A1	2007-03-08

Foreign References:

CN103773322A	2014-05-07
CN103849356A	2014-06-11
US20020018885A1	2002-02-14

Other References: