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Patent Searching and Data


Title:
HIGH-POWER LED HEAT DISSIPATION STRUCTURE BASED ON THERMOELECTRIC REFRIGERATION AND MICROCHANNEL HEAT TRANSFER
Document Type and Number:
WIPO Patent Application WO/2019/184794
Kind Code:
A1
Abstract:
A high-power LED heat dissipation structure based on thermoelectric refrigeration and microchannel heat transfer, comprising a substrate (2), an LED chip (1), a thermoelectric heat sink (4) and a microchannel heat exchanger (5), the LED chip (1) being mounted on the substrate (2); a hot end of the substrate (2) being connected to a cold end of the thermoelectric heat sink (4), and a hot end of the thermoelectric heat sink (4) being connected to a cold end of the microchannel heat exchanger (5). Said heat dissipation structure can significantly reduce the temperature of the hot end of the thermoelectric heat sink (4), so that the temperature of the LED chip (1) is actively reduced, directly by means of the thermoelectric heat sink (4), said heat dissipation structure has a good effect, and can improve the working performance, reliability and service life of the LED.

Inventors:
MO SONG PING (CN)
LIN XIAO HUI (CN)
CHEN YING (CN)
JIA LI SI (CN)
Application Number:
CN2019/079086
Publication Date:
October 03, 2019
Filing Date:
March 21, 2019
Export Citation:
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Assignee:
UNIV GUANGDONG TECHNOLOGY (CN)
International Classes:
H01L33/64; F21V29/00
Foreign References:
CN108417703A2018-08-17
CN208570659U2019-03-01
CN202469815U2012-10-03
CN107678524A2018-02-09
CN102597617A2012-07-18
US20150316246A12015-11-05
Attorney, Agent or Firm:
BEIJING WANBEI PATENT AGENCY OFFICE (CN)
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