Title:
HIGH POWER SAW METALLIZATION AND METHOD OF FABRICATION
Document Type and Number:
WIPO Patent Application WO2001069781
Kind Code:
A3
Abstract:
A high power SAW device (10) includes an electrode (16, 19) positioned on a piezoelectric substrate (11). The electrode includes a bonding layer (30) of material deposited on and bonding with the substrate and a conductive structure (35), of at least one layer of material, overlying the bonding layer and fixedly bonded to the substrate by the bonding layer. The conductive structure includes aluminum and an alloy metal with the alloy metal being in a range from approximately 1 % by weight to a percent providing for a favorable trade-off of resistivity versus mechanical properties. The alloy metal is selected from elements in one of the IV and VI columns of the periodic table, e.g. titanium, molybdenum, chromium, and tungsten.
Inventors:
MELLEN NEAL J
LAI SHOULIANG
LAI SHOULIANG
Application Number:
PCT/US2001/008125
Publication Date:
February 07, 2002
Filing Date:
March 14, 2001
Export Citation:
Assignee:
MOTOROLA INC (US)
CTS CORP (US)
CTS CORP (US)
International Classes:
H01L41/09; H01L41/18; H03H3/08; H03H9/145; (IPC1-7): H03H3/08
Domestic Patent References:
| WO2000033394A1 | 2000-06-08 |
Foreign References:
| EP0803919A1 | 1997-10-29 | |||
| US4775814A | 1988-10-04 |
Other References:
OTA Y ET AL: "TI-ADDED AL ELECTRODES ON LITAO3 36 DEG Y-X SUBSTRATES FOR HIGH POWER SURFACE ACOUSTIC WAVE DEVICES I", JAPANESE JOURNAL OF APPLIED PHYSICS, PUBLICATION OFFICE JAPANESE JOURNAL OF APPLIED PHYSICS. TOKYO, JP, vol. 32, 1 May 1993 (1993-05-01), pages 2351 - 2354, XP000570774, ISSN: 0021-4922
Download PDF:
Previous Patent: SYSTEM AND METHOD OF PRODUCING DIRECT AUDIO FROM A POWER SUPPLY
Next Patent: DUPLEXER WITH IMPROVED HARMONIC SUPPRESSION
Next Patent: DUPLEXER WITH IMPROVED HARMONIC SUPPRESSION