Title:
HIGH-PRECISION LARGE PANEL-LEVEL MICRO-ASSEMBLY DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/026957
Kind Code:
A1
Abstract:
A high-precision large panel-level micro-assembly device, comprising: a wafer stage (1), a first delivery mechanism (2), a rotation mechanism (3), a second delivery mechanism (4), and a die bonding stage (5). The first delivery mechanism (2) is located above the wafer stage (1), and delivers a die on the wafer stage (1) to the rotation mechanism (3); the rotation mechanism (3) is located between the wafer stage (1) and the die bonding stage (5), and comprises a turntable (31) that rotates with the axis perpendicular to the table surface as the rotation axis; the turntable (31) receives the die from the first delivery mechanism (2), and delivers the die to the second delivery mechanism (4) by means of rotation; the second delivery mechanism (4) is located above the die bonding stage (5), and the second delivery mechanism (4) delivers the die on the turntable (31) to the die bonding stage (5). The turntable performs die bonding and feeding by means of rotation, providing the advantages of short feeding stroke and high efficiency compared with a mode of feeding by using multiple rotation arms, thereby facilitating improvement of the die bonding efficiency and implementation of device miniaturization.
Inventors:
WANG CHI (CN)
Application Number:
PCT/CN2019/101957
Publication Date:
February 18, 2021
Filing Date:
August 22, 2019
Export Citation:
Assignee:
SUZHOU ACCURACY ASSEMBLY AUTOMATION CO LTD (CN)
International Classes:
H01L21/677; H01L21/687
Foreign References:
| CN104600015A | 2015-05-06 | |||
| CN205920952U | 2017-02-01 | |||
| CN108155124A | 2018-06-12 |
Attorney, Agent or Firm:
SUZHOU GUOCHENG PATENT AGENCY CO., LTD (CN)
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