Title:
HIGH-PRECISION HIGH-RELIABILITY TI/W-CU-AU COMPOSITE ELECTRODE THERMOSENSITIVE CHIP
Document Type and Number:
WIPO Patent Application WO/2020/134016
Kind Code:
A1
Abstract:
The present invention relates to a high-precision high-reliability Ti/W-Cu-Au composite electrode thermosensitive chip. The thermosensitive chip comprises a thermosensitive ceramic substrate and two composite electrodes which are respectively provided on two surfaces of the thermosensitive ceramic substrate, wherein the composite electrodes are formed by sequentially stacking a titanium tungsten layer, a copper layer, and a gold layer on the surface of the thermosensitive ceramic substrate from inside to outside. The present invention further relates to a preparation method for the high-precision high-reliability Ti/W-Cu-Au composite electrode thermosensitive chip. The high-precision high-reliability Ti/W-Cu-Au composite electrode thermosensitive chip of the present invention has advantages of being good in stability, high in reliability, not prone to aging, resistant to cold and hot impact and the like.
Inventors:
HE XIAODONG (CN)
DUAN ZHAOXIANG (CN)
YANG JUN (CN)
TANG LIMIN (CN)
BAI QIXING (CN)
DUAN ZHAOXIANG (CN)
YANG JUN (CN)
TANG LIMIN (CN)
BAI QIXING (CN)
Application Number:
PCT/CN2019/094984
Publication Date:
July 02, 2020
Filing Date:
July 08, 2019
Export Citation:
Assignee:
EXSENSE ELECTRONICS TECH CO LTD (CN)
International Classes:
C23C14/34; C23C14/16; C23C14/18; C04B41/88; G01K7/22; H01C7/00
Foreign References:
| CN109659104A | 2019-04-19 | |||
| CN109576655A | 2019-04-05 | |||
| CN102503580A | 2012-06-20 | |||
| CN106384635A | 2017-02-08 | |||
| CN106298120A | 2017-01-04 | |||
| CN107706495A | 2018-02-16 | |||
| US20100079234A1 | 2010-04-01 |
Attorney, Agent or Firm:
GUANGZHOU JUNCY INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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